Soldering in Electronics Assembly

Soldering in Electronics Assembly

Mike Judd and Keith Brindley (Auth.)
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''Soldering in Electronics Assembly'' starts at the bottom and works its way right to the top of this vast technical, yet practical subject. It covers all relevant aspects of the area, looking theoretically at every facet likely to be needed in a detailed study, yet it does so in a most practical manner. The book looks at soldering processes in the light of electronic assembly type, solder, flux and cleaning requirements. Every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wavesoldering and zoned forced convection infra-red machines are covered. Separate chapters consider safety and solder process quality assessment. Other important topics covered are: and a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability; a detailed analysis of soldering process defects and causes. The book is intended for use during industrial construction of electronics assemblies at a professional level. Managers, engineers and technicians involved in the soldering process can use the book as a reference to see the variety of methods available together with an up-to-date discussion of technical concerns
類別:
年:
1992
出版商:
Butterworth-Heinemann
語言:
english
頁數:
291
ISBN 10:
0750605898
ISBN 13:
9780750605892
文件:
PDF, 17.06 MB
IPFS:
CID , CID Blake2b
english, 1992
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